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of Gul Circle West Region

Listed twenty four days ago

Process Engineer (Hybrid Bonding/ TSV Reveal & Bumping)

at Applied Materials South East Asia Pte Ltd

This is a Full time job

One North, Central Region

$6,800 – $10,000 per month

subClassification: Process EngineeringProcess Engineering

classification: Engineering(Engineering)

World's No. 1 semiconductor equipment manufacturer
Fortune 500 company & Great Place to Work certified
Global learning opportunities and exposures

24d ago

Expiring soon

Listed six days ago

Process Engineer (Hybrid Bonding, TSV reveal & bumping)

at Applied Materials South East Asia Pte Ltd

This is a Full time job

Changi, East Region

subClassification: Process EngineeringProcess Engineering

classification: Engineering(Engineering)

6d ago

Listed twenty three days ago

Line Associate Engineer (Wafer Bumping - Equipment)

at United Test And Assembly Center Limited (UTAC)

This is a Full time job

Ang Mo Kio, North-East Region

subClassification: Electrical/Electronic EngineeringElectrical/Electronic Engineering

classification: Engineering(Engineering)

23d ago

Expiring soon

Listed twenty two days ago

Senior/Process Engineer (Wet Etch/Plating)

at STATS ChipPAC Pte. Ltd.

This is a Full time job

Khatib, North Region

subClassification: Process EngineeringProcess Engineering

classification: Engineering(Engineering)

22d ago

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