Senior Thin Film Process Engineer (ECP) | Semiconductor I GMP11356

A leading semiconductor company is proud to be recognized as one of the 17 companies certified as a 2025 Global Top Employer, and the first and only semiconductor company to achieve this distinction. This recognition reflects the company’s continuous commitment to improvement and excellence, particularly in the areas of ethics & integrity, purpose & values, organization & change, business strategy, and performance.

The company is committed to fostering a diverse and inclusive workplace where discrimination is not tolerated. It strives to recruit and retain a workforce that reflects the diversity of the communities around it, while promoting fairness in career development, career opportunities, and remuneration. Candidates who may not meet every requirement are still encouraged to apply, as diverse perspectives are valued and opportunities for growth and learning are provided. Diversity, equity, and inclusion (DEI) are deeply embedded in the company culture.

Job number: GMP11356

Key Responsibilities

• Develop, optimize, and sustain Electro Chemical Plating (ECP) Cu reinforcement and damascene fill processes on LAM Novellus SABRE tools.

• Define and fine-tune recipes and hardware configurations to achieve target thickness, uniformity, fill performance, and defect control.

• Collaborate with PVD barrier/seed and integration teams to ensure strong process integration from upstream (Ti, TiN, CVD TiN, Cu seed, etc.) to ECP outcomes.

• Perform structured process and hardware characterization, including experiments on flow, contact design, waveform, and chemistry conditions.

• Lead troubleshooting, excursion management, and root cause analysis for process issues.

• Implement permanent corrective and preventive actions to improve process stability, yield, and tool performance.

Job Requirements

• Bachelor’s or Master’s degree in Electrical/Electronic Engineering, Microelectronics, Materials Science, Applied Physics, Chemical or Mechanical Engineering, or a related discipline.

• Minimum 5 years of hands-on experience with ECP copper processes on LAM Novellus SABRE systems in a semiconductor fab environment.

• Strong knowledge of semiconductor manufacturing, vacuum technology, and thin film deposition, including PVD barrier/seed fundamentals.

• Strong collaboration and communication skills, with ability to document and present findings clearly through technical reports, reviews, and data summaries, and actively participate in cross-functional teams and project discussions.

• Proven problem-solving capability, including advanced root cause analysis, failure mode identification, and implementation of robust and sustainable solutions.

We regret that only shortlisted candidates will be notified.

Interested applicants may email Lay Yong at lay••••••••@gmprecruit.com for further details, quoting Job Number: GMP11356.

GMP Recruitment Services (S) Pte Ltd  | EA Licence: 09C3051  | Tan Lay Yong I Registration No: R23112814