Advanpack Solutions is a leading knowledge-based company focused in the research, development and proliferation of advanced semiconductor packaging technologies. Among our inventions are the patented Copper Pillar Bump, No-Flow Underfills, P-Coat epoxy fluxes, advanced substrates (micro-MIS) and proprietary packaging technologies encompassing replacement of current BGA packages, QFN packages and Wafer Level Chip Scale packages. Our Intellectual Properties have been licensed to the world’s top semiconductor companies enabling them to deliver more advanced and cost effective products to their customers.Join us in our drive to continue providing cutting edge, innovative and disruptive solutions to the electronics packaging industry !!
Advanpack Solutions is a leading knowledge-based company focused in the research, development and proliferation of advanced semiconductor packaging technologies. Among our inventions are the patented Copper Pillar Bump, No-Flow Underfills, P-Coat epoxy fluxes, advanced substrates (micro-MIS) and proprietary packaging technologies encompassing replacement of current BGA packages, QFN packages and Wafer Level Chip Scale packages. Our Intellectual Properties have been licensed to the world’s top semiconductor companies enabling them to deliver more advanced and cost effective products to their customers.Join us in our drive to continue providing cutting edge, innovative and disruptive solutions to the electronics packaging industry !!
Advanpack Solutions is a leading knowledge-based company focused in the research, development and proliferation of advanced semiconductor packaging technologies. Among our inventions are the patented Copper Pillar Bump, No-Flow Underfills, P-Coat epoxy fluxes, advanced substrates (micro-MIS) and proprietary packaging technologies encompassing replacement of current BGA packages, QFN packages and Wafer Level Chip Scale packages. Our Intellectual Properties have been licensed to the world’s top semiconductor companies enabling them to deliver more advanced and cost effective products to their customers.Join us in our drive to continue providing cutting edge, innovative and disruptive solutions to the electronics packaging industry !!