Capcon Limited, established in Hong Kong in 2014, a leading company to provide innovative solutions for semiconductor advanced packaging industry and electronics manufacturing service industry. With strong market trend in semiconductor advanced packaging and high-end Electronics Manufacturing Service (EMS) industries, the Company satisfies its customers with innovative products such as high precision, high productivity Die Bonder and Flip Chip Bonder, Chip-on-Wafer Bonder, Package-on-Package Bonder to increase Customer’s Total Cost Of Ownership.
Capcon Limited, established in Hong Kong in 2014, a leading company to provide innovative solutions for semiconductor advanced packaging industry and electronics manufacturing service industry. With strong market trend in semiconductor advanced packaging and high-end Electronics Manufacturing Service (EMS) industries, the Company satisfies its customers with innovative products such as high precision, high productivity Die Bonder and Flip Chip Bonder, Chip-on-Wafer Bonder, Package-on-Package Bonder to increase Customer’s Total Cost Of Ownership.
Capcon Limited, established in Hong Kong in 2014, a leading company to provide innovative solutions for semiconductor advanced packaging industry and electronics manufacturing service industry. With strong market trend in semiconductor advanced packaging and high-end Electronics Manufacturing Service (EMS) industries, the Company satisfies its customers with innovative products such as high precision, high productivity Die Bonder and Flip Chip Bonder, Chip-on-Wafer Bonder, Package-on-Package Bonder to increase Customer’s Total Cost Of Ownership.